Apparatus for applying a sintering force via a compressible film

Sintering apparatus for simultaneously sintering an electronic device onto a substrate, and a metallic sheet onto the electronic device, the sintering apparatus comprising:

• a sinter tool;
• and
• a compressible film positionable onto the metallic sheet and the electronic device, the compressible film comprising a fibrillated membrane expanded at a predetermined stretch ratio to form a porous structure having a lower density than a similar membrane that is unexpanded;
• wherein a thickness of the compressible film is greater than a height of the metallic sheet, and the compressible film is adapted to conform to a shape of the metallic sheet and the electronic device to simultaneously cover an exposed area of the metallic sheet and at least a part of an exposed area of the electronic device when the sinter tool applies a sintering force onto the compressible film during a sintering process, and
• wherein a volume of the compressible film is configured to change when the sintering force is applied onto the compressible film so as to apply a uniform sintering pressure distribution on the exposed areas of the metallic sheet and the electronic device, which are located at different heights.