Angled flying lead wire bonding process
AssigneeInternational Business Machines Corporation
InventorsBrian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da-Yuan Shih
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Abstract
A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.
Claims8
A process for making angled flying lead wire structures attached to an electronic circuit component comprising:
- a first process step used to bond said flying lead wire to a first surface of said electronic circuit component;
- a second process step where the movement of the wire capillary tool and an XY stage are controlled to form a desired shape in said flying lead wire;
- a third process step where a single shear blade mechanism is positioned in contact with said flying lead wire;
- a forth process step where said capillary tool is raised to tension said wire against said shear blade and sever said wire.
A process for making flying lead wire structures attached to an electronic circuit component comprising:
- bonding said flying lead wire to a first surface of said electronic circuit component;
- controlling the movement of the wire capillary tool and an XY stage to form a desired shape in said flying lead wire;
- shearing said flying lead wire with a double shear blade mechanism positioned on opposite sides of said flying lead wire and creating a small nick on opposite side of said wire;
- said capillary tool is raised to sever said wire at the point where said nicks were formed by said shear blades, said flying lead wires having wire tip end.
Dependencies are inferred from the claim text.