Wire bonding apparatus, wire bonding method and semiconductor device
AssigneeYangtze Memory Technologies Co., Ltd.
InventorXuhui Wang
Life of this patent
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Abstract
The present disclosure provides a wire bonding apparatus, a wire bonding method and a semiconductor device. The wire bonding apparatus includes: a wire tube for containing the wire and including a wire exit; a wire heating assembly located at a side of the wire exit; and a pre-shaping assembly located at a side of the wire tube and including a wire pre-pressing face; the pre-shaping assembly having a first state in which the wire pre-pressing face of the pre-shaping assembly is configured to abut the wire tube and a second state in which the pre-shaping assembly is configured to disengage from the wire tube. The wire bonding apparatus, the wire bonding method and the semiconductor device as provided in the present disclosure can reduce or eliminate the cratering effect.
Claims20
A wire bonding apparatus, comprising:
- a wire tube configured to contain a wire and comprising a wire exit;
- a wire heating assembly located at a side of the wire exit;
- and
- a pre-shaping assembly located at a side of the wire tube and comprising a wire pre-pressing face;
- and
- wherein the pre-shaping assembly has a first state and a second state, the wire pre-pressing face of the pre-shaping assembly in the first state configured to abut the wire tube, and the pre-shaping assembly in the second state configured to disengage from the wire tube,
- wherein the wire pre-pressing face is a camber surface, a circle to which the camber surface of the wire pre-pressing face belongs has a radius greater than a radius of a circle to which a camber surface of a solder ball formed by heating the wire protruding out of the wire tube belongs.
A wire bonding method, comprising:
- starting a wire heating assembly to convert a wire protruding from a wire exit of a wire tube into an initial solder ball;
- driving a pre-shaping assembly to move relative to the wire exit such that a wire pre-pressing face of the pre-shaping assembly contacts the initial solder ball;
- driving the wire tube to move in a first direction relative to the pre-shaping assembly so as to generate a pre-pressure between the initial solder ball and the wire pre-pressing face of the pre-shaping assembly to convert the initial solder ball into a solder ball, wherein a height of the initial solder ball in the first direction is greater than a height of the solder ball in the first direction;
- driving the pre-shaping assembly to move away from the wire tube;
- and
- placing a first bonding element on a bonding site, driving the wire tube to move in the first direction relative to the first bonding element, and bonding the solder ball on the first bonding element,
- wherein the wire pre-pressing face is a camber surface, a circle to which the camber surface of the wire pre-pressing face belongs has a radius greater than a radius of a circle to which a camber surface of a solder ball formed by heating the wire protruding out of the wire tube belongs.
Dependencies are inferred from the claim text.