Angled flying lead wire bonding process
AssigneeInternational Business Machines Corporation
InventorsBrian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Da-Yuan Shih
Life of this patent
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Abstract
A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.
Claims31
A process for making angled flying lead wire structures attached to an electronic circuit component comprising:
- a first process step used to bond said flying lead wire to a first surface of said electronic circuit component;
- a second process step where the movement of the wire capillary tool and an XY stage are controlled to form a desired shape in said flying lead wire;
- a third process step where a single shear blade mechanism is positioned in contact with said flying lead wire;
- a forth process step where said capillary tool is raised to tension said wire against said shear blade and sever said wire;
- said flying lead wire is coated with a material.
A process for making flying lead wire structures attached to an electronic circuit component comprising:
- bonding said flying lead wire to a first surface of said electronic circuit component;
- controlling the movement of the wire capillary tool and an XY stage to form a desired shape in said flying lead wire;
- shearing said flying lead wire with a double shear blade mechanism positioned on opposite sides of said flying lead wire and creating a small nick on opposite side of said wire;
- said capillary tool is raised to sever said wire at the point where said nicks were formed by said shear blades, said flying lead wires having wire tip end;
- said flying lead wire is coated with a material.
A method comprising:
- providing a substrate surface having a plurality of wire bondable locations;
- wire bonding a wire to each of said wire bondable locations using a wire capillary tool;
- controlling the position of said capillary tool with respect to said substrate;
- after forming a wire bond of said wire to said wire bondable location moving said capillary tool relative to said surface to form a wire having a predetermined shape, and severing said wire at a free end and said wire is coated with a material.
A process for making angled flying lead wire structures attached to an electronic circuit component comprising:
- a first process step used to bond said flying lead wire to a first surface of said electronic circuit component;
- a second process step where the movement of the wire capillary tool and an XY stage are controlled to form a desired shape in said flying lead wire;
- a third process step where a single shear blade mechanism is positioned in contact with said flying lead wire;
- a forth process step where said capillary tool is raised to tension said wire against said shear blade and sever said wire;
- said flying lead wire tip end is coated with a material.
A process for making flying lead wire structures attached to an electronic circuit component comprising:
- bonding said flying lead wire to a first surface of said electronic circuit component;
- controlling the movement of the wire capillary tool and an XY stage to form a desired shape in said flying lead wire;
- shearing said flying lead wire with a double shear blade mechanism positioned on opposite sides of said flying lead wire and creating a small nick on opposite side of said wire;
- said capillary tool is raised to sever said wire at the point where said nicks were formed by said shear blades, said flying lead wires having wire tip end;
- said flying lead wire tip end is coated with a material.
A method comprising:
- providing a substrate surface having a plurality of wire bondable locations;
- wire bonding a wire to each of said wire bondable locations using a wire capillary tool;
- controlling the position of said capillary tool with respect to said substrate;
- after forming a wire bond of said wire to said wire bondable location moving said capilary tool relative to said surface to form a wire having a predetermined shape, and severing said wire at a free end and said wire tip end is coated with a material.
Dependencies are inferred from the claim text.