H10W 72/07125
Means for controlling the bonding environment
Official title: {Means for controlling the bonding environment, e.g. valves or vacuum pumps}
H10W72/07125 (Means for controlling the bonding environment) appears on 254 US grants and 311 published applications in this corpus.
Search patents in H10W- Granted patents
- 254
- Published applications
- 311
- Assignees
- 150
- Inventors
- 667
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 3 |
| 2003 | 2 | 5 |
| 2004 | 1 | 6 |
| 2005 | 3 | 2 |
| 2006 | 1 | 5 |
| 2007 | 2 | 3 |
| 2008 | 0 | 1 |
| 2009 | 4 | 5 |
| 2010 | 1 | 6 |
| 2011 | 2 | 6 |
| 2012 | 6 | 14 |
| 2013 | 11 | 13 |
| 2014 | 6 | 15 |
| 2015 | 12 | 24 |
| 2016 | 16 | 19 |
| 2017 | 15 | 21 |
| 2018 | 20 | 16 |
| 2019 | 16 | 18 |
| 2020 | 17 | 18 |
| 2021 | 14 | 32 |
| 2022 | 18 | 19 |
| 2023 | 22 | 12 |
| 2024 | 17 | 20 |
| 2025 | 14 | 10 |
| 2026 | 11 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package11 Aug 2026US 12,703,044 B2Samsung Electronics Co., Ltd.
- Solder reflow apparatus and method of manufacturing an electronic device4 Aug 2026US 12,701,664 B2Samsung Electronics Co., Ltd.
- System and method for fluxless thermocompression bonding4 Aug 2026US 12,702,038 B2Asmpt Singapore Pte. Ltd.
- Bonding systems for bonding a semiconductor element to a substrate, and related methods9 Jun 2026US 12,653,056 B2Kulicke and Soffa Industries, Inc.
- Bonding systems for bonding a semiconductor element to a substrate, and related methods12 May 2026US 12,628,682 B2Kulicke and Soffa Industries, Inc.
- Semiconductor Device and Method of Making Using Dual-Laser Compression Bonding17 Sep 2026US 2026/0282989 A1JCET STATS ChipPAC Korea Limited
- Bonding systems for bonding a semiconductor element to a substrate, and related methods20 Aug 2026US 2026/0248013 A1Kulicke and Soffa Industries, Inc.
- Joining system and jig30 Jul 2026US 2026/0216808 A1Nippon Avionics Co., Ltd.
- Semiconductor chip alignment method, bonding method, electronic component manufacturing device, and electronic component manufacturing system30 Jul 2026US 2026/0223714 A1Tokyo University of Science Foundation
- Semiconductor chip laser bonding device23 Jul 2026US 2026/0215315 A1Viatron Technologies Inc.
Most cited
By later US patents
- Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration234US 7,037,804 B2Intel Corporation · 2006
- Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof226US 6,975,016 B2Intel Corporation · 2005
- Method for packaging integrated circuit chips employing a polymer film overlay layer103US 4,933,042 AGeneral Electric Company · 1990
- Product using Zn-Al alloy solder90US 6,563,225 B2Hitachi, Ltd. · 2003
- Method and apparatus for insulating moisture sensitive PBGA's72US 6,059,170 AInternational Business Machines Corporation · 2000