Semiconductor chip alignment method, bonding method, electronic component manufacturing device, and electronic component manufacturing system

A bonding method for stacking and bonding a second semiconductor chip on a first semiconductor chip, the bonding method comprising:

• an ultrasonic vibrating step of ultrasonically vibrating the first semiconductor chip;
• a self-aligning step of bringing close a lower surface of the second semiconductor chip to an upper surface of the first semiconductor chip, so as to overlap with the first semiconductor chip that is ultrasonically vibrating, releasing the second semiconductor chip, and self-aligning the second semiconductor chip on the first semiconductor chip in a state where the second semiconductor chip is floating from the upper surface of the first semiconductor chip;
• and
• a bonding step of reducing ultrasonic vibration of the first semiconductor chip until the lower surface of the second semiconductor chip contacts the upper surface of the first semiconductor chip, and stacking and bonding the second semiconductor chip to the first semiconductor chip.

An electronic component manufacturing device, provided for stacking and bonding a second semiconductor chip to a first semiconductor chip, the electronic component manufacturing device comprising:

• a stage, provided for adsorption-fixing the first semiconductor chip to an adsorption surface on an upper side;
• a collet, provided for holding and releasing the second semiconductor chip;
• a bonding head, provided for moving the collet in a direction along the adsorption surface of the stage and a direction of approaching and departing from the adsorption surface;
• an ultrasonic vibrator, provided for ultrasonically vibrating the stage;
• and
• a control part, provided for adjusting an operation among the collet, the bonding head, and the ultrasonic vibrator,
• wherein the control part comprises a processor for performing information processing, and
• the processor is configured for:
• ultrasonically vibrating the first semiconductor chip by ultrasonically vibrating the stage by using the ultrasonic vibrator;
• moving the collet holding the second semiconductor chip to a position overlapping with the first semiconductor chip by using the bonding head and lowering the collet until a lower surface of the second semiconductor chip is close to an upper surface of the first semiconductor chip;
• releasing the second semiconductor chip from the collet and self-aligning the second semiconductor chip onto the first semiconductor chip in a state where the second semiconductor chip is floating from the upper surface of the first semiconductor chip;
• and
• reducing an output of the ultrasonic vibrator and bringing the lower surface of the second semiconductor chip into contact with the upper surface of the first semiconductor chip, and stacking and bonding the second semiconductor chip to the first semiconductor chip.