Back to results
US 2026/0248013 A1Published application
Bonding systems for bonding a semiconductor element to a substrate, and related methods
AssigneeKulicke and Soffa Industries, Inc.
InventorsAdeel Ahmad Bajwa, Thomas J. Colosimo, JR., Matthew B. Wasserman, Robert N. Chylak
Life of this patent
Estimating the term…
Abstract
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a manifold configured to provide a reducing gas to a bonding area of the bonding system. At least a portion of the manifold is heated.
Claims22
A bonding system for bonding a semiconductor element to a substrate, the bonding system comprising:
- a reducing gas delivery system configured to provide a reducing gas to a bonding area of a bonding system during a bonding operation;
- a gas delivery line configured to transport the reducing gas from a reducing gas source to the reducing gas delivery system, at least a portion of the gas delivery line being heated;
- and
- a bonding tool configured to bond the semiconductor element to the substrate in connection with the bonding operation.
1 more element
A method of bonding a semiconductor element to a substrate, the method comprising the steps of:
- (a) directing a reducing gas from a reducing gas source to a bonding area of a bonding system using a gas delivery line;
- (b) heating at least a portion of the gas delivery line;
- and
- (c) bonding the semiconductor element to the substrate at the bonding area.
1 more element
Dependencies are inferred from the claim text.