Method for packaging integrated circuit chips employing a polymer film overlay layer
AssigneeGeneral Electric Company
InventorsCharles W. Eichelberger, Robert J. Wojnarowski, Kenneth B. Welles, II
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Abstract
A method and apparatus are provided for disposing a polymer film on an irregularly-shaped substrate at relatively high temperatures. In particular, the method and apparatus of the present invention provide a system for the packaging of very large scale intergrated circuit chips. The system of the present invention particularly solves problems associated with high temperature processing and problems associated with the highly irregular surfaces that result. Nonetheless, the resultant product is capable of being fashioned into circuit chip systems which are independently testable and which may be reconfigured after testing by removal of the polymer film itself.
Claims14
A method for bonding a polymer film to a surface of at least one semiconductor chip device, said method comprising:
- (a) disposing said polymer film over said at least one chip device but not in substantial contact therewith;
- (b) applying vacuum conditions above and below said film so as to evacuate the volume around said chip while maintaining said non-contact condition;
- (c) heating said film while maintaining said vacuum conditions so as to remove, from between said film and said chip device, outgassing products released during said heating;
- (d) applying fluid pressure conditions above said film to create a pressure differential across said film so as to force said film into contact with said at least one chip device to adhere said film to said device, cooling said device and film to bond said film to said device;
- and
- (e) then removing said pressure differential whereby, during said heating step, said film is heated to a temperature which is sufficient to bond said film to said at least one chip device during step (d).
A method for bonding a polymer film to a surface of at least one circuit chip and a substrate on which at least one circuit chip is disposed, said method comprising:
- (a) disposing said film over at least one of circuit chip and substrate but not in contact therewith;
- (b) applying vacuum conditions above and below said film so as to evaluate the volume around said chip and substrate while maintaining said non-contact condition;
- (c) heating said film while maintaining said vacuum conditions so as to remove, from between said film and said chip and substrate, outgassing products released during said heating;
- (d) applying fluid pressure conditions above said film to create a pressure differential across said film so as to force said film into contact with said at least one chip and substrate to adhere said film to said chip and substrate;
- (e) cooling said chip, substrate and film to bond said film to said chip and substrate;
- and
- (f) then removing said pressure differential whereby, during said heating step, said film is heated to a temperature which is sufficient to bond said film to said at least one chip device during steps (d) and (e).
A method for bonding a polymer film to at least two integrated circuit chips disposed on a substrate, said method comprising:
- (a) disposing said film over said chips but not in contact therewith;
- (b) applying vacuum conditions above and below said film so as to evacuate the volume around said chips while maintaining said non-contact condition;
- (c) heating said film while maintaining said vacuum conditions so as to remove, from between said film and said chips, outgassing products released during said heating;
- (d) applying fluid pressure conditions above said film to create a pressure differential across said film to force said film into contact with said chips to adhere said film to said chips;
- (e) cooling said chips and film to bond said film to said chips;
- and
- (f) removing said pressure differential whereby, during said heating step, said film is heated to a temperature which is sufficient to bond said film to said at least one chip device during steps (d) and (e).
Dependencies are inferred from the claim text.