Method and apparatus for insulating moisture sensitive PBGA's

A method for removing a component having a solder joint grid array from a circuitized substrate, the solder joints having a first temperature at which they melt, the component having a second temperature, greater than the first temperature, over which the component is damaged, the method comprising the steps of:

• (a) placing a thermal shield over the component,
• (b) preheating the circuitized substrate and the component having the solder joint grid array to a third temperature lower than the first temperature,
• (c) directing a stream of hot gas of a fourth temperature for a predetermined time about the periphery of the thermal shield such that the solder joints reach the first temperature thereby breaking the solder joints, while other parts of the component reach less than the second temperature, and
• (d) removing the component from the circuitized substrate.

An apparatus for attaching a component having a solder ball grid array to a circuitized substrate, the solder balls having a first temperature at which they melt, the component having a second temperature, greater than the first temperature, over which the component is damaged, the apparatus comprising:

• means for preheating the circuitized substrate to a third temperature lower than the first temperature,
• means for placing the component on the circuitized substrate,
• a thermal shield disposed over the component, and
• means for directing a stream of hot gas of a fourth temperature for a predetermined time about the periphery of the thermal shield such that the solder balls reach the first temperature thereby forming solder joints, while other parts of the component reach less than the second temperature.

An apparatus for removing a component having a solder joint grid array from a circuitized substrate, the solder joints having a first temperature at which the solder melts, the component having a second temperature, greater than the first temperature, over which the component is damaged, the apparatus comprising:

• a thermal shield disposed over the component,
• means for preheating the circuitized substrate and the component having the solder joint grid array to a third temperature lower than the first temperature,
• means for directing a stream of hot gas of a fourth temperature for a predetermined time about the periphery of the component with the thermal shield such that the solder joints reach the first temperature thereby breaking the solder joints, while other parts of the component reach less than the second temperature, and
• means for removing the component from the circuitized substrate.