Semiconductor chip laser bonding device

Abstract

The present invention discloses a semiconductor chip laser bonding device including s laser irradiation module having laser oscillating regions from which a laser beam is oscillated, the laser oscillating regions being extended in a first direction and spaced apar from each other in a second direction, and laser non-oscillating regions from which no laser beam is oscillated, each laser non-oscillating region being arranged between the laser oscillating regions; and a horizontal transfer module configured to move the laser irradiation module in the second direction, wherein when the laser irradiation module irradiates the laser beam onto an upper surface of a bonding substrate on which a semiconductor chip is mounted, the horizontal transfer module reciprocates the laser irradiation module in the second direction.

Dependencies are inferred from the claim text.