Product using Zn-Al alloy solder
AssigneeHitachi, Ltd.
InventorsTasao Soga, Toshiharu Ishida, Kazuma Miura, Hanae Hata, Masahide Okamoto, Tetsuya Nakatsuka
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Abstract
There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a Al—Mg—Ge—Zn alloy, said Al particles being connected to each other by said Al—Mg—Ge—Zn alloy phase.
Claims17
An electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a solder joint comprising a phase of Al particles and another phase of a Zn—Al—Mg—Ge alloy, said Al particles being connected to each other by said another phase.
A semiconductor device comprising a semiconductor chip, electrode pads provided on said semiconductor chip, a substrate on which said semiconductor chip is mounted, a lead of said substrate which lead is electrically connected to said electrode pads through a gold wire, and a solder joint, said semiconductor chip and said substrate being bonded by said solder joint comprising a phase of Al particles and another phase of a Zn—Al—Mg—Ge alloy.
A semiconductor device comprising a semiconductor chip, electrode pads provided on said semiconductor chip, a substrate on which said semiconductor chip is mounted, a lead of said substrate which lead is electrically connected to said electrode pads through a gold wire, and a solder joint, said semiconductor chip and said substrate being bonded by said solder joint comprising a phase of Cu particles and another phase of a Zn—Al—Mg—Ge alloy.
Dependencies are inferred from the claim text.