Bonding systems for bonding a semiconductor element to a substrate, and related methods
AssigneeKulicke and Soffa Industries, Inc.
InventorsAdeel Ahmad Bajwa, Thomas J. Colosimo, Jr., Matthew B. Wasserman, Robert N. Chylak
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Abstract
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a reducing gas delivery system configured to provide a reducing gas to a bonding area of a bonding system. The bonding system also includes a gas delivery line configured to transport the reducing gas from a reducing gas source to the reducing gas delivery system. At least a portion of the gas delivery line is heated.
Claims29
A bonding system for bonding a semiconductor element to a substrate, the bonding system comprising:
- a reducing gas delivery system configured to provide a reducing gas to a bonding area of the bonding system;
- and
- a gas delivery line configured to transport the reducing gas from a reducing gas source to the reducing gas delivery system, at least a portion of the gas delivery line being heated,
- wherein the gas delivery line is heated according to a heat profile,
- wherein the heat profile includes a time-based heating process having a first temperature setpoint prior to bonding and a second temperature setpoint during bonding.
A method of bonding a semiconductor element to a substrate, the method comprising the steps of:
- (a) directing a reducing gas from a reducing gas source to a bonding area of a bonding system using a gas delivery line;
- (b) heating at least a portion of the gas delivery line according to a heat profile, wherein the heat profile includes a time-based heating process having a first temperature setpoint prior to bonding and a second temperature setpoint during bonding;
- and
- (c) bonding the semiconductor element to the substrate at the bonding area.
A bonding system for bonding a semiconductor element to a substrate, the bonding system comprising:
- a reducing gas delivery system configured to provide a reducing gas to a bonding area of a bonding system during a bonding operation;
- a gas delivery line configured to transport the reducing gas from a reducing gas source to the reducing gas delivery system, at least a portion of the gas delivery line being heated;
- and
- a bonding tool configured to carry the semiconductor element and to bond the semiconductor element to the substrate in connection with the bonding operation.
Dependencies are inferred from the claim text.