Solder reflow apparatus and method of manufacturing an electronic device

A method of manufacturing an electronic device, the method comprising:

• forming a plurality of vapor passage holes that penetrate a substrate entirely from a bottom surface of the substrate to a top surface of the substrate, the substrate having a plurality of mounting regions on which electronic components are mounted respectively;
• disposing the electronic components on the substrate via bumps;
• loading the substrate on which the electronic components are disposed into a vapor generating chamber that accommodates a first heat transfer fluid;
• heating the first heat transfer fluid to generate a second heat transfer fluid in a vapor state within the vapor generating chamber;
• supplying the second heat transfer fluid in the vapor state through at least one of the plurality of vapor passage holes;
• and
• soldering the bumps using the second heat transfer fluid in the vapor state,
• wherein the plurality of vapor passage holes are formed in a cutting region that is disposed around the plurality of mounting regions.

A method of manufacturing an electronic device, the method comprising:

• forming a plurality of vapor passage holes that penetrate a substrate entirely from a bottom surface of the substrate to a top surface of the substrate, the substrate having a plurality of mounting regions on which electronic components are mounted respectively;
• printing a solder paste on substrate pads of the substrate;
• forming solders on input/output pads of the electronic components and
• disposing the electronic components on the substrate such that the solders are interposed between the input/output pads and the solder paste;
• loading the substrate on which the electronic components are disposed into a vapor generating chamber that accommodates a first heat transfer fluid;
• heating the first heat transfer fluid to generate a second heat transfer fluid in a vapor state within the vapor generating chamber;
• supplying the second heat transfer fluid in the vapor state through at least one of the plurality of vapor passage holes;
• soldering the solders using the second heat transfer fluid in the vapor state,
• wherein the plurality of vapor passage holes are formed in a cutting region that is disposed around the plurality of mounting regions.