H10W 72/07118
Means for cleaning
Official title: {Means for cleaning, e.g. brushes}
H10W72/07118 (Means for cleaning) appears on 153 US grants and 187 published applications in this corpus.
Search patents in H10W- Granted patents
- 153
- Published applications
- 187
- Assignees
- 98
- Inventors
- 401
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 3 |
| 2002 | 5 | 4 |
| 2003 | 3 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 5 |
| 2007 | 1 | 3 |
| 2008 | 0 | 4 |
| 2009 | 2 | 1 |
| 2010 | 2 | 2 |
| 2011 | 2 | 4 |
| 2012 | 4 | 4 |
| 2013 | 2 | 7 |
| 2014 | 3 | 13 |
| 2015 | 7 | 16 |
| 2016 | 5 | 9 |
| 2017 | 15 | 14 |
| 2018 | 12 | 18 |
| 2019 | 12 | 14 |
| 2020 | 13 | 13 |
| 2021 | 5 | 11 |
| 2022 | 10 | 6 |
| 2023 | 13 | 7 |
| 2024 | 5 | 11 |
| 2025 | 10 | 8 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System and method for fluxless thermocompression bonding4 Aug 2026US 12,702,038 B2Asmpt Singapore Pte. Ltd.
- Post-plasma clean infrared image inspection for oxideless bonding and apparatus for effecting the same2 Jun 2026US 12,646,160 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Solder reflow system and solder reflow method using the same21 Apr 2026US 12,605,749 B2Samsung Electronics Co., Ltd.
- Apparatus and method for wafer oxide removal and reflow treatment30 Dec 2025US 12,512,431 B2Air Products and Chemicals, Inc.
- Bonding with pre-deoxide process and apparatus for performing the same4 Nov 2025US 12,463,175 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Post-plasma clean infrared image inspection for oxideless bonding and apparatus for effecting the same17 Sep 2026US 2026/0278765 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor chip bonding apparatus and fume collection method thereof16 Jul 2026US 2026/0206629 A1Hanmi Semiconductor, Inc.
- Wafer-to-wafer direct bonding method14 May 2026US 2026/0136844 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Flux cleaning jig7 May 2026US 2026/0130256 A1Samsung Electronics Co., Ltd.
- Electronic component mounting device and electronic component mounting method30 Apr 2026US 2026/0123500 A1Kabushiki Kaisha Shinkawa
Most cited
By later US patents
- Method of fabricating an electronic circuit device and apparatus for performing the method48US 6,227,436 B1Hitachi, Ltd. · 2001
- Method for enabling conventional wire bonding to copper-based bond pad features35US 6,358,847 B1Lam Research Corporation · 2002
- Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer27US 9,142,532 B2Bondtech Co., Ltd. · 2015
- Hybrid bonding and apparatus for performing the same26US 9,331,032 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Hybrid bonding systems and methods for semiconductor wafers23US 10,103,122 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018