Electronic component mounting device and electronic component mounting method

An electronic component mounting device, comprising:

• an electronic component supply part that supplies an electronic component having a bump electrode;
• a transfer stage that stores flux;
• a mounting stage on which a substrate is placed;
• a connecting member which connects a plurality of heads that are capable of picking up the electronic component at a predetermined interval and which inter-connectedly operates the plurality of heads in a direction along a placement surface of the mounting stage on which the electronic component is placed;
• and
• a controller that controls operations of the plurality of heads,
• wherein the controller is configured to allocate and enable the plurality of heads to function as a dipping head that immerses the bump electrode of the electronic component into the flux stored in the transfer stage, and as a bonding head that mounts the electronic component to the substrate on the mounting stage via the bump electrode, and
• the controller is configured to pick up the electronic component in a state of being immersed in the flux from the transfer stage by the bonding head by moving the connecting member by the predetermined interval after releasing the electronic component in the state of being immersed in the flux from the dipping head on the transfer stage.