US 2026/0206629 A1Published application

Semiconductor chip bonding apparatus and fume collection method thereof

AssigneeHanmi Semiconductor, Inc.

InventorJun Su Byun

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Abstract

The present invention relates to a semiconductor chip bonding apparatus for applying flux to a lower surface of a semiconductor chip on which bumps are formed and bonding the semiconductor chip to a substrate by heating and pressing the flux-applied chip, and to a fume collection method thereof. The invention quickly collects and removes vaporized fume of flux generated during thermocompression bonding, preventing contamination of the semiconductor chip and the bonding tool and preventing fume from entering fine gaps that may cause malfunction of vacuum suction. Even if fume enters the tool passage and chip passage of the heating block and solidifies, it can be liquefied and vaporized, with liquefied fume dropping to the bottom surface in the fume collection unit while vaporized fume is suctioned and removed, enabling quick removal and maintaining the passages in good condition.

Claims11

Dependent claims

A semiconductor chip bonding apparatus for applying flux to a lower surface of a semiconductor chip on which bumps are formed, and bonding the semiconductor chip to a substrate by heating and pressing the semiconductor chip to which the flux is applied, the apparatus comprising:

a bonding head, wherein the bonding head comprises:
a bonding tool having a suction hole formed therein for suctioning the semiconductor chip;
a heating block provided on an upper portion of the bonding tool, having a tool passage formed therein for attaching and detaching the bonding tool and a chip passage communicating with the suction hole, and including a heating member;
a tool flow path communicating with the tool passage;
a tool ejector for supplying negative pressure or positive pressure to suction or detach the bonding tool through the tool flow path;
a chip flow path communicating with the chip passage;
and
a chip ejector for supplying negative pressure or positive pressure to suction or detach the semiconductor chip through the chip flow path,
wherein the bonding head further comprises:
a cleaning flow path communicating with the tool flow path and the chip flow path;
and
a cleaning air supply unit for supplying air to remove solidified fume inside the tool passage and the chip passage through the cleaning flow path.

9 more elements

Dependencies are inferred from the claim text.