Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer

A method for laminating plural chip layers each comprising chips, the number of the chips being a predetermined number and each of the chips having a first bond surface having one or more metal regions and a second bond surface positioned on a rear side of the first bond surface, in a multilayered form over a substrate having plural bond portions, thereby bonding the chip layers to the substrate,

• the method comprising:
• causing particles having a predetermined kinetic energy to collide with at least the metal region(s) of the first bond surface of each of the chips to subject the metal region(s) to surface activating treatment, and further causing water to adhere onto the metal region(s) to subject the metal region(s) to hydrophilizing treatment,
• causing particles having a predetermined kinetic energy to collide with the bond portions of the substrate to subject the bond portions to surface activating treatment, and further causing water to adhere onto the bond portions to subject the bond portions to hydrophilizing treatment,
• fitting each of the chips subjected to the surface activating treatment and the hydrophilizing treatment, the number of the chips being the predetermined number, onto the corresponding bond portion of the substrate subjected to the surface activating treatment and the hydrophilizing treatment, so as to bring the metal region(s) of the chip into contact with the bond portion of the substrate,
• causing particles having a predetermined kinetic energy to collide with at least the metal region(s) of the first bond surface of each of the chips to be next fitted, the number of the chips being the predetermined number, thereby subjecting the metal region(s) to surface activating treatment, and further causing water to adhere to the metal region(s), thereby subjecting the metal region(s) to hydrophilizing treatment,
• causing particles having a predetermined kinetic energy to collide with the second bond surface of each of chips on a topmost layer, the number of the chips being the predetermined number, out of the entire chips laminated over the substrate, thereby surface-activating the second bond surface, and further causing water to adhere to the second bond surface, thereby subjecting the second bond surface to hydrophilizing treatment,
• fitting, out of the entire chips, chips subjected to the surface activating treatment and the hydrophilizing treatment and to be next fitted, the number of these chips being the predetermined number, onto the chips subjected to the surface activating treatment and the hydrophilizing treatment on the topmost layer, the number of these chips being the predetermined number, so as to bring the metal regions of the chips to be next fitted into contact with the respective second bond surfaces of the chips on the topmost layer, the number of the chips being the predetermined number, and
• fitting the entire chips to the substrate to be made into the multilayered form over the substrate, and subsequently heating the resultant structure, which includes the substrate and the chips fitted over the substrate.

A device comprising a usable-for-chip surface activating treatment means which causes particles having a predetermined kinetic energy to collide with a chip-side-bond-surface of plural chips to subject at least a metal region(s) of the chip-side-bond-surface to surface activating treatment,

• a usable-for-substrate surface activating treatment means which causes particles having a predetermined kinetic energy to collide with bond portions of the substrate to subject the bond portions of the substrate to surface activating treatment,
• a usable-for-chip hydrophilizing treatment means which causes water to adhere to the metal region(s) of each of the chips, which is/are subjected to the surface activating treatment, to subject the metal region(s) of the chip to hydrophilizing treatment,
• a usable-for-substrate hydrophilizing treatment means which causes water to adhere to the bond portions of the substrate, which are subjected to the surface activating treatment, to subject the bond portions of the substrate to hydrophilizing treatment, and
• a chip fitting means which fits each of the chips onto the corresponding bond portion of the substrate to bring the metal region(s) of the chip into contact with the bond portion of the substrate.

A device comprising:

• a usable-for-first-bond-surface activating treatment means which causes particles having a predetermined kinetic energy to collide with a first bond surface of each of a plurality of chips to subject the first bond surface of each chip to surface activating treatment,
• a usable-for-chip-second-bond-surface activating treatment means which causes particles having a predetermined kinetic energy to collide with a second bond surface of the chip that is positioned on the rear side of the first bond surface of the chip to subject the second bond surface of the chip to surface activating treatment,
• a usable-for-substrate surface activating treatment means which causes particles having a predetermined kinetic energy to collide with the bond portions of the substrate to subject the bond portions of the substrate to surface activating treatment,
• a usable-for-chip-first-bond-surface hydrophilizing treatment means which causes water to adhere to the first bond surface of each of the chips subjected to the surface activating treatment to subject the first bond surface of the chip to hydrophilizing treatment,
• a usable-for-chip-second-bond-surface hydrophilizing treatment means which causes water to adhere to the second bond surface of the chip subjected to the surface activating treatment, the second bond surface being positioned on the rear side of the first bond surface of the chip, to subject the second bond surface of the chip to hydrophilizing treatment,
• a usable-for-substrate hydrophilizing treatment means which causes water to adhere to the bond portions of the substrate to subject the bond portions of the substrate to hydrophilizing treatment, and
• a chip fitting means which fits each of some of the chips onto the corresponding bond portion of the substrate to bring the metal region(s) of the chip into contact with the bond portion of the substrate, and which fits, out of the entire chips, chips to be next fitted on the chips fitted onto the substrate, so as to bring the respective first bond surfaces of the chips to be next fitted into contact with the respective second bond surfaces of the chips fitted onto the substrate.

A method for bonding plural chips each having a chip-side-bond-surface having one or more metal regions to a substrate having plural bond portions,

• the method comprising:
• causing particles having a predetermined kinetic energy to collide with at least the metal region(s) of the chip-side-bond-surface to subject the metal region(s) to surface activating treatment, and further causing water to adhere onto the metal region(s) to subject the metal region(s) to hydrophilizing treatment,
• causing particles having a predetermined kinetic energy to collide with the bond portions of the substrate to subject the bond portions to surface activating treatment, and further causing water to adhere onto the bond portions to subject the bond portions to hydrophilizing treatment,
• fitting each of the chips subjected to the surface activating treatment and the hydrophilizing treatment onto the corresponding bond portion of the substrate subjected to the surface activating treatment and the hydrophilizing treatment to bring the metal region(s) of the chip into contact with the bond portion of the substrate, to obtain a resultant structure comprising the substrate and the chips fitted onto the substrate, and
• heating the resultant structure,
• the chips each having a thickness of 10 to 300 μm.