Apparatus and method for wafer oxide removal and reflow treatment
AssigneeAir Products and Chemicals, Inc.
InventorsLiang Wu, Wenshan Pang, Lulu Qi, Xiang Yu, Leijian Yu, Jiong Chen, Gregory Khosrov Arslanian, Yuxiang Zhou
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Abstract
The present invention relates to an apparatus and method for wafer oxide removal and reflow treatment. In particular, the present invention relates to an apparatus for wafer oxide removal and reflow treatment, comprising: a heating plate, a sample plate for supporting a wafer sample above the heating plate, and an electron attachment pin plate above the sample plate, wherein the heating plate is configured to be capable of moving up and down, and contacting and heating the sample plate.
Claims13
An apparatus for wafer oxide removal and reflow treatment, comprising:
- a heating plate,
- a sample plate for supporting a wafer sample above the heating plate, and
- an electron attachment pin plate above the sample plate,
- wherein the heating plate is configured to be capable of moving up and down, and contacting and heating the sample further comprising a shelf for supporting the sample plate, wherein the shelf is located between the sample plate and the heating plate and configured to allow the heating plate to lift the sample plate.
Dependencies are inferred from the claim text.