Flux cleaning jig
AssigneeSamsung Electronics Co., Ltd.
InventorSOONCHUL LEE
Life of this patent
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Abstract
One embodiment of the present disclosure provides a flux cleaning jig including a lower jig on which a substrate to which a plurality of semiconductor chips is attached by conductive bumps is configured to be seated, and an upper jig disposed on the lower jig, and having a plurality of openings in which at least a portion on the semiconductor chips are configured to be disposed, the upper jig including a partition disposed between adjacent openings from among the plurality of openings, and a frame surrounding the partition, in which the partition includes a section in which a width increases in a direction from the upper jig toward the lower jig.
Claims20
A flux cleaning jig comprising:
- a lower jig on which a substrate, to which a plurality of semiconductor chips is attached by conductive bumps, is configured to be seated;
- and
- an upper jig disposed on the lower jig, the upper jig having a plurality of openings in which at least a portion of the semiconductor chips are configured to be disposed, the upper jig comprising a partition disposed between adjacent openings from among the plurality of openings, and the upper jig including a frame surrounding the partition,
- wherein the partition comprises a section in which a width increases in a first direction from the upper jig toward the lower jig.
A flux cleaning jig comprising:
- a lower jig on which a substrate, to which a plurality of semiconductor chips is attached by conductive bumps, is configured to be seated;
- an upper jig disposed on the lower jig, the upper jig having a plurality of openings in which at least a portion of the semiconductor chips are disposed, the upper jig comprising a partition disposed between adjacent openings from among the plurality of openings, and the upper jig including a frame surrounding the partition;
- and
- a plurality of first support pillars coupled to a lower surface of the upper jig and configured to press the substrate seated on the lower jig.
A flux cleaning jig comprising:
- a lower jig on which a substrate, to which a plurality of semiconductor chips is attached by conductive bumps, is configured to be seated;
- an upper jig disposed on the lower jig, the upper jig having a plurality of openings in which at least a portion of the semiconductor chips are configured to be disposed, the upper jig comprising a partition disposed between adjacent openings from among the plurality of openings, and the upper jig including a frame surrounding the partition;
- and
- a plurality of support pillars coupled to a lower surface of the upper jig, the plurality of support pillars being configured to press the substrate seated on the lower jig,
- wherein the partition comprises a section in which a width increases in a direction from the upper jig toward the lower jig.
Dependencies are inferred from the claim text.