Method of fabricating an electronic circuit device and apparatus for performing the method
AssigneeHitachi, Ltd.
InventorsToru Nishikawa, Ryohei Satoh, Masahide Harada, Tetsuya Hayashida, Mitugu Shirai
Life of this patent
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Abstract
In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.
Claims20
A method of soldering for use in fabricating an electronic circuit device, comprising the steps of:
- removing at least one of an oxide layer and a contamination layer from respective surfaces of a solder material and at least one member to be connected thereto, by laser beam cleaning;
- aligning said at least one member and said solder material in an oxidizing atmosphere;
- and
- heating said solder material in a nonoxidizing atmosphere to melt the solder material.
A method of soldering for use in fabricating an electronic circuit device, comprising the steps of:
- removing at least one of an oxide layer and a contamination layer from respective surfaces of a solder material and at least one member to be connected thereto, by laser beam cleaning;
- oxidizing said surfaces to form a thin oxide layer thereon;
- aligning said at least one member and said solder material;
- and
- heating said solder material in a nonoxidizing atmosphere to melt the solder material.
A method of soldering for use in fabricating an electronic circuit device, comprising the steps of:
- processing a solder material to ensure that no oxide layer and no contamination layer are present thereon, by laser beam cleaning;
- thereafter, aligning at least one electronic circuit device member and said solder material in an oxidizing atmosphere;
- and
- then heating said solder material in a nonoxidizing atmosphere to melt the solder material.
A fluxless bonding method for bonding a connecting member of an integrated circuit, comprising the steps of:
- removing at least one of an oxide layer and a contamination layer from respective surfaces of a solder material and at least one connecting member to be connected thereto, by laser beam cleaning;
- aligning said at least one connecting member and said solder material in an oxidizing atmosphere;
- and
- heating said solder material in a nonoxidizing atmosphere to melt the solder material.
Dependencies are inferred from the claim text.