Solder reflow system and solder reflow method using the same

A solder reflow system comprising:

• a solder reflow apparatus configured to reflow a solder of a semiconductor package using a heat transfer fluid;
• a condensation apparatus configured to receive the semiconductor package processed by the solder reflow apparatus, the condensation apparatus configured to condense a gas generated from the heat transfer fluid to convert the gas into a liquid;
• an inlet line connected between the solder reflow apparatus and the condensation apparatus to introduce the gas generated in the solder reflow apparatus into the condensation apparatus;
• a cleaning apparatus configured to perform an ultrasonic cleaning process on the semiconductor package processed by the condensation apparatus using a deionized (DI) water;
• and
• a return line connected between the solder reflow apparatus and the condensation apparatus to return the liquid in the condensation apparatus to the solder reflow apparatus.

A method of manufacturing a semiconductor device comprising:

• reflowing a solder of a semiconductor package by performing vapor phase soldering comprising generating a superheated vapor by heating a heat transfer fluid in a reflow chamber, the superheated vapor comprising a gas;
• obtaining, in a condensation chamber, at least a portion of the superheated vapor generated in the reflow chamber;
• condensing, in the condensation chamber, the at least portion of the superheated vapor into a liquid;
• and
• cleaning the semiconductor package using a cleaning agent in a cleaning chamber.