H10W 72/07152
Means for cooling
Official title: {Means for cooling}
H10W72/07152 (Means for cooling) appears on 126 US grants and 150 published applications in this corpus.
Search patents in H10W- Granted patents
- 126
- Published applications
- 150
- Assignees
- 69
- Inventors
- 345
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 2 | 3 |
| 2008 | 0 | 0 |
| 2009 | 1 | 2 |
| 2010 | 0 | 0 |
| 2011 | 0 | 5 |
| 2012 | 6 | 9 |
| 2013 | 3 | 11 |
| 2014 | 3 | 5 |
| 2015 | 9 | 20 |
| 2016 | 10 | 12 |
| 2017 | 14 | 17 |
| 2018 | 12 | 7 |
| 2019 | 12 | 11 |
| 2020 | 11 | 7 |
| 2021 | 3 | 9 |
| 2022 | 9 | 9 |
| 2023 | 10 | 2 |
| 2024 | 6 | 6 |
| 2025 | 5 | 3 |
| 2026 | 3 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Baffles for electronic circuits immersed in cooling fluid in a tank7 Jul 2026US 12,677,663 B2Auradine, Inc.
- Apparatus for and method for aligning dipoles and method of fabricating display device19 May 2026US 12,635,464 B2Samsung Display Co., Ltd.
- Method for forming a package structure10 Feb 2026US 12,550,769 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Sintering press for sintering electronic components on a substrate12 Aug 2025US 12,388,033 B2Amx—Automatrix S.R.L.
- Diffusion soldering and/or sintering device, die and system, for connecting components of at least one electronic assembly3 Jun 2025US 12,318,858 B2Pink GmbH Thermosysteme
- Joining system and jig30 Jul 2026US 2026/0216808 A1Nippon Avionics Co., Ltd.
- Thermal compression bonding method and a compression head for performing such method16 Jul 2026US 2026/0206631 A1STATS ChipPAC Management Pte. Ltd.
- Micro-controlled environment carrier with pedestals2 Jul 2026US 2026/0183840 A1Boschman Technologies B.V.
- Method for producing circuit connection structure, and circuit connection device2 Jul 2026US 2026/0191073 A1
- Baffles for electronic circuits immersed in cooling fluid in a tank4 Jun 2026US 2026/0157181 A1Auradine, Inc.
Most cited
By later US patents
- Connecting structure of electronic part and electronic device using the structure134US 5,086,337 AHitachi, Ltd. · 1992
- IC component mounting method and apparatus51US 5,667,129 AMatsushita Electric Industrial Co., Ltd. · 1997
- Method of bonding a chip part to a substrate using solder bumps40US 5,984,165 AFujitsu Limited · 1999
- Cooling structure for electronic components37US 6,034,875 AInternational Business Machines Corporation · 2000
- Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer27US 9,142,532 B2Bondtech Co., Ltd. · 2015