Method for producing circuit connection structure, and circuit connection device

A method for manufacturing a circuit connection structure, comprising:

• a step (a) of disposing a circuit connection material comprising a solder connection material and an adhesive on a surface, on which a first electrode is formed, of a first circuit member having the first electrode;
• a step (b) of disposing a second circuit member having a second electrode on the first circuit member so that the first electrode and the second electrode face each other;
• a step (c) of thermally compressing the first circuit member and the second circuit member at a temperature equal to or higher than a melting point of the solder connection material in a state in which the solder connection material is interposed between the first electrode and the second electrode;
• and
• a step (d) of cooling while applying a pressure between the first electrode and the second electrode until a temperature between the first electrode and the second electrode becomes a temperature equal to or lower than the melting point of the solder connection material from a temperature equal to or higher than the melting point of the solder connection material.