Baffles for electronic circuits immersed in cooling fluid in a tank
AssigneeAuradine, Inc.
InventorsAnuya Reddy, Pranav Kalyanraman
Life of this patent
Estimating the term…
Abstract
Examples of devices for providing cooling solutions are described. One example device at least one printed circuit board (PCB) and at least one baffle cover positioned along an edge of the at least one PCB. The at least one PCB is immersed in a cooling fluid in a tank. The at least one PCB includes one or more integrated circuit (IC) chips with a thermal interface material (TIM) applied to surfaces of the one or more IC chips that are coupled to a boilerplate. The baffle cover includes one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB.
Claims20
A system comprising:
- at least one baffle cover;
- and
- a container comprising (i) a chassis configured to mount at least one printed circuit board (PCB), and (ii) one or more couplers along a side of the container to hold the at least one baffle cover,
- wherein the at least one baffle cover is configured to form an enclosure for the container, the at least one baffle cover being positioned proximate to an edge of the at least one PCB mounted on the chassis, and
- wherein the container is configured to be immersed in a cooling fluid in a tank, and the at least one baffle cover comprises one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB when the container is immersed in the cooling fluid in the tank.
A system comprising:
- at least one baffle cover;
- and
- a container comprising (i) a chassis configured to mount at least one printed circuit board (PCB), and (ii) one or more couplers along a side of the container to hold the at least one baffle cover,
- wherein the at least one baffle cover is configured to form an enclosure for the container, wherein the container is immersed in a cooling fluid in a tank in a vertical orientation, and wherein the at least one baffle cover is positioned along a top edge of the at least one PCB that is proximate to an upper surface of the cooling fluid, and
- wherein the container is configured to be immersed in a cooling fluid in a tank, and the at least one baffle cover comprises one or more openings that are configured to control an agitation of the cooling fluid proximate to the top edge of the at least one PCB when the container is immersed in the cooling fluid in the tank.
A system comprising:
- a first baffle cover and a second baffle cover;
- and
- a container comprising (i) a chassis configured to mount at least one printed circuit board (PCB), and (ii) one or more couplers,
- wherein the first baffle cover and the second baffle cover are placed in parallel and are positioned at two opposing sides of the container, wherein the at least one PCB is positioned between the first baffle and the second baffle, and wherein the one or more couplers are placed along the two opposing sides of the container to hold the first baffle cover and the second baffle cover,
- wherein the first baffle cover and the second baffle cover are configured to form an enclosure for the container, the first baffle cover and the second baffle cover being respectively positioned proximate to a top edge and a bottom edge of the at least one PCB mounted on the chassis, and
- wherein the container is configured to be immersed in a cooling fluid in a tank, and each of the first baffle cover and the second baffle comprises one or more openings configured to control an agitation of a cooling fluid proximate to the top edge or bottom edge of the at least one PCB when the container is immersed in the cooling fluid in a tank.
Dependencies are inferred from the claim text.