H10W 72/073
Of die-attach connectors
Official title: {of die-attach connectors}
H10W72/073 (Of die-attach connectors) appears on 22,960 US grants and 26,376 published applications in this corpus.
Search patents in H10W- Granted patents
- 22,960
- Published applications
- 26,376
- Assignees
- 2,735
- Inventors
- 27,706
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 21 | 0 |
| 1977 | 23 | 0 |
| 1978 | 16 | 0 |
| 1979 | 12 | 0 |
| 1980 | 15 | 0 |
| 1981 | 13 | 0 |
| 1982 | 24 | 0 |
| 1983 | 15 | 0 |
| 1984 | 18 | 0 |
| 1985 | 23 | 0 |
| 1986 | 21 | 0 |
| 1987 | 23 | 0 |
| 1988 | 32 | 0 |
| 1989 | 49 | 0 |
| 1990 | 46 | 0 |
| 1991 | 65 | 0 |
| 1992 | 77 | 0 |
| 1993 | 69 | 0 |
| 1994 | 86 | 0 |
| 1995 | 74 | 0 |
| 1996 | 94 | 0 |
| 1997 | 114 | 0 |
| 1998 | 194 | 0 |
| 1999 | 213 | 0 |
| 2000 | 294 | 0 |
| 2001 | 365 | 175 |
| 2002 | 371 | 551 |
| 2003 | 416 | 470 |
| 2004 | 442 | 604 |
| 2005 | 417 | 710 |
| 2006 | 444 | 731 |
| 2007 | 451 | 782 |
| 2008 | 425 | 808 |
| 2009 | 441 | 872 |
| 2010 | 660 | 807 |
| 2011 | 711 | 930 |
| 2012 | 729 | 976 |
| 2013 | 878 | 964 |
| 2014 | 913 | 1120 |
| 2015 | 1066 | 1321 |
| 2016 | 1162 | 1300 |
| 2017 | 1214 | 1284 |
| 2018 | 1162 | 1257 |
| 2019 | 1248 | 1454 |
| 2020 | 1318 | 1721 |
| 2021 | 1228 | 1715 |
| 2022 | 1284 | 1664 |
| 2023 | 1276 | 1202 |
| 2024 | 1165 | 1308 |
| 2025 | 1004 | 1018 |
| 2026 | 539 | 632 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/07331Connecting techniques10,220
- H10W 72/07351Characterised by changes in properties of the die-attach connectors during connecting4,775
- H10W 72/07302Using an auxiliary member1,911
- H10W 72/07321Aligning1,170
- H10W 72/07311Treating the bonding area before connecting819
- H10W 72/07341Controlling the bonding environment493
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Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015