H10W 72/07302
Using an auxiliary member
Official title: {using an auxiliary member}
H10W72/07302 (Using an auxiliary member) appears on 1,911 US grants and 2,318 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,911
- Published applications
- 2,318
- Assignees
- 437
- Inventors
- 3,007
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 5 | 7 |
| 2003 | 5 | 7 |
| 2004 | 8 | 21 |
| 2005 | 8 | 15 |
| 2006 | 11 | 15 |
| 2007 | 9 | 16 |
| 2008 | 3 | 25 |
| 2009 | 16 | 24 |
| 2010 | 15 | 25 |
| 2011 | 25 | 47 |
| 2012 | 21 | 62 |
| 2013 | 71 | 65 |
| 2014 | 66 | 86 |
| 2015 | 71 | 123 |
| 2016 | 97 | 144 |
| 2017 | 147 | 144 |
| 2018 | 129 | 175 |
| 2019 | 171 | 162 |
| 2020 | 172 | 231 |
| 2021 | 157 | 217 |
| 2022 | 158 | 242 |
| 2023 | 166 | 136 |
| 2024 | 191 | 155 |
| 2025 | 121 | 117 |
| 2026 | 56 | 56 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Display apparatus29 Sep 2026US 12,751,319 B2LG Display Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Package with solder mask1 Sep 2026US 12,727,487 B2NXP USA, Inc.
- Semiconductor device and method for producing semiconductor device8 Oct 2026US 2026/0314503 A1Resonac Corporation
- Heterogeneous antenna in fan-out package1 Oct 2026US 2026/0302595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing semiconductor devices and corresponding semiconductor device1 Oct 2026US 2026/0305498 A1STMicroelectronics International N. V.
- Underfill adhesive flow control using dam structure24 Sep 2026US 2026/0293738 A1QUALCOMM Incorporated
- Method for Forming an Interconnect Structure17 Sep 2026US 2026/0282941 A1
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011