H10W 72/07304
The auxiliary member being temporary
Official title: {the auxiliary member being temporary, e.g. a sacrificial coating}
H10W72/07304 (The auxiliary member being temporary) appears on 1,763 US grants and 2,103 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,763
- Published applications
- 2,103
- Assignees
- 394
- Inventors
- 2,635
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 5 | 7 |
| 2003 | 5 | 7 |
| 2004 | 8 | 21 |
| 2005 | 8 | 15 |
| 2006 | 11 | 15 |
| 2007 | 9 | 16 |
| 2008 | 3 | 23 |
| 2009 | 15 | 19 |
| 2010 | 13 | 23 |
| 2011 | 23 | 45 |
| 2012 | 19 | 51 |
| 2013 | 66 | 62 |
| 2014 | 60 | 74 |
| 2015 | 65 | 114 |
| 2016 | 90 | 133 |
| 2017 | 138 | 132 |
| 2018 | 119 | 164 |
| 2019 | 159 | 150 |
| 2020 | 159 | 222 |
| 2021 | 145 | 195 |
| 2022 | 147 | 218 |
| 2023 | 158 | 122 |
| 2024 | 171 | 136 |
| 2025 | 111 | 99 |
| 2026 | 44 | 39 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Display apparatus29 Sep 2026US 12,751,319 B2LG Display Co., Ltd.
- Semiconductor package with a scratch protection layer and method of fabrication11 Aug 2026US 12,707,974 B2Infineon Technologies Austria AG
- Packaging structure including an underfill outflanked by a substrate and an electronic device28 Jul 2026US 12,696,786 B2Advanced Semiconductor Engineering, Inc.
- Method of manufacturing an electronic device and electronic device manufactured thereby28 Jul 2026US 12,696,789 B2Amkor Technology Singapore Holding Pte.Ltd.
- Heterogeneous antenna in fan-out package1 Oct 2026US 2026/0302595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for Forming an Interconnect Structure17 Sep 2026US 2026/0282941 A1
- Package structure and method of forming the same17 Sep 2026US 2026/0283013 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and manufacturing method thereof17 Sep 2026US 2026/0283014 A1Powerchip Semiconductor Manufacturing Corporation
- Semiconductor package and manufacturing method thereof10 Sep 2026US 2026/0271788 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011