Semiconductor package and manufacturing method thereof

A semiconductor package, comprising:

• a semiconductor die having a front surface and a back surface;
• first conductive terminals deployed on the front surface of the semiconductor die;
• a dielectric layer formed along the back surface of the semiconductor die;
• second conductive terminals disposed on the dielectric layer and extending through the dielectric layer;
• conductive posts disposed around the semiconductor die;
• and
• an interconnect structure with a top surface in contact with the second conductive terminals and the conductive posts.

A semiconductor package, comprising:

• a first die comprising active devices, and having a front surface and a back surface;
• a second die and a third die over the front surface of the first die, and are electrically connected to the first die;
• a dielectric layer formed along the back surface of the first die;
• and
• conductive terminals disposed on the dielectric layer and extending through the dielectric layer to contact the back surface of the first die.