Package structure and method of forming the same

A package structure, comprising:

• a first integrated circuit component disposed on an interposer, wherein the first integrated circuit component has a recess;
• a plurality of conductive connectors disposed between the first integrated circuit component and the interposer;
• an underfill layer laterally surrounding the plurality of conductive connectors and formed between the first integrated circuit component and the interposer;
• and
• a Fiber Assembly Unit (FAU) attached to the first integrated circuit component, wherein the FAU comprises an optical fiber aligned to the first integrated circuit component through the recess.

A package structure, comprising:

• a photonic component comprising:
• a supporting substrate;
• an electronic die bonded to the supporting substrate;
• and
• a photonic die over the electronic die, wherein the supporting substrate has an edge portion protruding from a first edge of the photonic die and a second edge of the electronic die;
• an interposer formed on the photonic component;
• and
• an underfill layer formed between the photonic component and the interposer, wherein a portion of the first edge of the photonic die is free of the underfill layer.