H10W 72/07307
The auxiliary member being a temporary substrate
Official title: {the auxiliary member being a temporary substrate, e.g. a removable substrate}
H10W72/07307 (The auxiliary member being a temporary substrate) appears on 1,398 US grants and 1,668 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,398
- Published applications
- 1,668
- Assignees
- 292
- Inventors
- 2,026
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 0 |
| 2003 | 2 | 3 |
| 2004 | 2 | 1 |
| 2005 | 0 | 2 |
| 2006 | 1 | 8 |
| 2007 | 1 | 5 |
| 2008 | 0 | 17 |
| 2009 | 7 | 7 |
| 2010 | 7 | 20 |
| 2011 | 10 | 33 |
| 2012 | 11 | 35 |
| 2013 | 50 | 45 |
| 2014 | 42 | 58 |
| 2015 | 49 | 103 |
| 2016 | 82 | 114 |
| 2017 | 126 | 118 |
| 2018 | 105 | 134 |
| 2019 | 136 | 129 |
| 2020 | 133 | 187 |
| 2021 | 119 | 142 |
| 2022 | 117 | 173 |
| 2023 | 122 | 99 |
| 2024 | 141 | 116 |
| 2025 | 94 | 88 |
| 2026 | 36 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011