Semiconductor package with a scratch protection layer and method of fabrication
AssigneeInfineon Technologies Austria AG
InventorsFrank Singer, Martin Mayer
Life of this patent
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Abstract
A semiconductor package includes: a carrier having a first side and an opposing second side; a semiconductor die arranged on the first side of the carrier; a heat conductor part arranged on the second side of the carrier; an encapsulation body encapsulating the semiconductor die, wherein the heat conductor part is exposed from the encapsulation body, and wherein the heat conductor part has a different material composition than the encapsulation body; and a scratch protection layer covering the heat conductor part, wherein the scratch protection layer has a hardness which is at least five times higher than a hardness of the heat conductor part.
Claims15
A semiconductor package, comprising:
- a carrier comprising a first side and an opposing second side;
- a semiconductor die arranged on the first side of the carrier;
- a heat conductor part arranged on the second side of the carrier;
- an encapsulation body encapsulating the semiconductor die, wherein the heat conductor part is exposed from the encapsulation body, and wherein the heat conductor part has a different material composition than the encapsulation body;
- and
- a scratch protection layer covering the heat conductor part, wherein the scratch protection layer has a hardness which is at least five times higher than a hardness of the heat conductor part.
A method for fabricating a semiconductor package, the method comprising:
- providing a carrier with a first side and an opposing second side;
- arranging a semiconductor die on the first side of the carrier;
- arranging a heat conductor part on the second side of the carrier;
- encapsulating the semiconductor die with an encapsulation body such that the heat conductor part is exposed from the encapsulation body, wherein the heat conductor part has a different material composition than the encapsulation body;
- and
- covering the heat conductor part with a scratch protection layer, wherein the scratch protection layer has a hardness which is at least five times higher than a hardness of the heat conductor part.
Dependencies are inferred from the claim text.