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US 12,696,786 B2Granted
Packaging structure including an underfill outflanked by a substrate and an electronic device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorShih-Chieh Tang
Life of this patent
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Abstract
A package structure includes a substrate, an electronic device, an underfill, and an underfill guide structure. The electronic device is disposed over the substrate. The underfill is outflanked by the substrate and the electronic device. The underfill guide structure is disposed outside of a vertical projection of the circuit structure and horizontally overlaps a gap between the substrate and the electronic device, and configured to reduce an extension of a portion of the underfill outside of the vertical projection along a lateral surface of the electronic device.
Claims7
A package structure, comprising:
- a substrate;
- an electronic device disposed over the substrate;
- an underfill outflanked by the substrate and the electronic device;
- and
- an underfill guide structure disposed outside of a vertical projection of the electronic device and horizontally overlapping a gap between the substrate and the electronic device, and configured to reduce an extension of a portion of the underfill outside of the vertical projection along a lateral surface of the electronic device,
- wherein the underfill guide structure includes a first protrusion outflanked by the underfill,
- wherein the portion of the underfill comprises a first part contacting the first protrusion and a second part contacting the first protrusion, and wherein the first part is closer to the gap than the second part is, and a thickness of the first part is greater than a thickness of the second part,
- wherein the first protrusion comprises a first pillar disposed on the substrate, and a width of the substrate is greater than a width of the electronic device, wherein the first pillar comprises a first metal and a second metal disposed on the first metal, and a lateral surface of the first metal is recessed from a lateral surface of the second metal.
5 more elements
Dependencies are inferred from the claim text.