Semiconductor structure and manufacturing method thereof

Abstract

A semiconductor structure including a carrier wafer structure and transistor wafer structures is provided. The transistor wafer structures are stacked on the carrier wafer structure. Each of the transistor wafer structures includes a transistor wafer, a first bonding layer, and a second bonding layer. The transistor wafer has a first side and a second side opposite to each other. The first bonding layer is located on the first side of the transistor wafer. The second bonding layer is located on the second side of the transistor wafer. The first bonding layer of one of two adjacent transistor wafer structures is bonded to the second bonding layer of the other of the two adjacent transistor wafer structures.

Dependencies are inferred from the claim text.