Semiconductor device and method for producing semiconductor device

Abstract

A semiconductor device includes: a substrate; a first semiconductor chip having a rectangular shape and disposed over the substrate; a plurality of spacers disposed around the first semiconductor chip over the substrate; a second semiconductor chip facing the substrate to cover the first semiconductor chip; and an adhesive layer provided on a surface of the second semiconductor chip to face the first semiconductor chip, and bonded to the first semiconductor chip and the plurality of spacers, in which the plurality of spacers include a first main spacer and a second main spacer disposed on both sides of the first semiconductor chip in a longitudinal direction of the first semiconductor chip, and a first additional spacer and a second additional spacer disposed on both sides of the first semiconductor chip in a lateral direction of the first semiconductor chip.

Dependencies are inferred from the claim text.