H10W 72/07341
Controlling the bonding environment
Official title: {Controlling the bonding environment, e.g. atmosphere composition or temperature}
H10W72/07341 (Controlling the bonding environment) appears on 493 US grants and 636 published applications in this corpus.
Search patents in H10W- Granted patents
- 493
- Published applications
- 636
- Assignees
- 267
- Inventors
- 1,260
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 6 |
| 2003 | 2 | 3 |
| 2004 | 1 | 3 |
| 2005 | 5 | 2 |
| 2006 | 6 | 6 |
| 2007 | 1 | 7 |
| 2008 | 6 | 13 |
| 2009 | 7 | 13 |
| 2010 | 12 | 13 |
| 2011 | 6 | 11 |
| 2012 | 7 | 22 |
| 2013 | 4 | 17 |
| 2014 | 20 | 44 |
| 2015 | 28 | 31 |
| 2016 | 35 | 39 |
| 2017 | 22 | 47 |
| 2018 | 35 | 49 |
| 2019 | 39 | 46 |
| 2020 | 57 | 69 |
| 2021 | 43 | 58 |
| 2022 | 30 | 43 |
| 2023 | 45 | 23 |
| 2024 | 32 | 27 |
| 2025 | 23 | 24 |
| 2026 | 18 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Heterogeneous annealing method and device28 Jul 2026US 12,696,818 B2Adeia Semiconductor Bonding Technologies Inc.
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- Microwave-reactive micro-heater, method for device transfer and bonding using the same, and apparatus therefor13 Aug 2026US 2026/0239499 A1Electronics and Telecommunications Research Institute
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Most cited
By later US patents
- Room temperature metal direct bonding236US 8,524,533 B2Ziptronix, Inc. · 2013
- Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials229US 6,335,263 B12002
- Heterogeneous annealing method and device223US 9,184,125 B2Ziptronix, Inc. · 2015
- Three dimensional device integration method and integrated device220US 7,126,212 B2Ziptronix, Inc. · 2006
- Room temperature metal direct bonding220US 9,385,024 B2Ziptronix, Inc. · 2016