Semiconductor device having chip capacitor connected to semiconductor chip with wires

A semiconductor device comprising:

• a base material having a first terminal;
• a semiconductor chip having a first electrode pad electrically connected with the first terminal, a second electrode pad to which a power supply potential is to be supplied, and a third electrode pad to which a reference potential is to be supplied, and mounted on the base material via a first member;
• a chip capacitor having a first electrode and a second electrode, and mounted on the semiconductor chip via a second member;
• a first wire electrically connecting the first electrode pad with the first terminal;
• a second wire electrically connecting the second electrode pad with the first electrode without going through the base material;
• a third wire electrically connecting the third electrode pad with the second electrode without going through the base material;
• and
• a resin sealing body sealing the semiconductor chip, the chip capacitor, the first wire, the second wire and the third wire,
• wherein a length of each of the second wire and the third wire is shorter than a length of the first wire,
• wherein the power supply potential is to be supplied from the chip capacitor to the semiconductor chip without going through the base material, and
• wherein the reference potential is to be supplied from the chip capacitor to the semiconductor chip without going through the base material.