Conductive paste and bonding method using same
AssigneeAmogreentech Co., Ltd.
InventorJaehoon MAENG
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Abstract
The present invention relates to a conductive paste and a bonding method using same. The conductive paste comprises: silver powder; and a binder, wherein the silver powder includes first to fourth silver particle groups. Here, the first silver particle group, the second silver particle group, and the third silver particle group are groups of flake-shaped particles with different average particle diameters (D50) and different average aspect ratio ranges, and the fourth silver particle group is composed of a group of spherical particles, such that it is possible to manufacture an assembly with high shear strength even under low pressure conditions.
Claims12
A conductive paste comprising silver powder and a binder,
- wherein the silver powder includes a first silver particle group, a second silver particle group, a third silver particle group, and a fourth silver particle group,
- wherein the first silver particle group, the second silver particle group, and the third silver particle group are flake-shaped particle groups respectively having different average particle diameters (D50) and different average aspect ratio ranges, and
- wherein the fourth silver particle group is a spherical particle group.
Dependencies are inferred from the claim text.