Semiconductor die package and methods of manufacturing

A method, comprising:

• forming a first pad structure on a first portion of a seed layer;
• forming a connection structure on a second portion of the seed layer, wherein the second portion of the seed layer is laterally spaced from the first portion of the seed layer;
• forming a first integrated circuit die over the first pad structure;
• and
• forming a second integrated circuit die between the first pad structure and the connection structure,
• wherein the second integrated circuit die is laterally spaced from the connection structure and the first integrated circuit die.

A method, comprising:

• forming a mold component comprising:
• a first pad structure,
• a first connection structure, wherein the first connection structure is laterally spaced from the first pad structure, and wherein the first connection structure resides on a same horizontal plane as the first pad structure,
• a first integrated circuit die over the first pad structure;
• a second integrated circuit die between the first pad structure and the first connection structure,
• wherein the second integrated circuit die is laterally spaced from the first connection structure and the first integrated circuit die;
• forming a first interconnection structure over the mold component;
• and
• forming one or more connection components on the first interconnection structure.