H10W 72/07331
Connecting techniques
Official title: {Connecting techniques}
H10W72/07331 (Connecting techniques) appears on 10,220 US grants and 11,550 published applications in this corpus.
Search patents in H10W- Granted patents
- 10,220
- Published applications
- 11,550
- Assignees
- 1,879
- Inventors
- 16,049
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 21 | 0 |
| 1977 | 22 | 0 |
| 1978 | 13 | 0 |
| 1979 | 10 | 0 |
| 1980 | 15 | 0 |
| 1981 | 11 | 0 |
| 1982 | 20 | 0 |
| 1983 | 14 | 0 |
| 1984 | 16 | 0 |
| 1985 | 19 | 0 |
| 1986 | 18 | 0 |
| 1987 | 20 | 0 |
| 1988 | 23 | 0 |
| 1989 | 38 | 0 |
| 1990 | 39 | 0 |
| 1991 | 53 | 0 |
| 1992 | 50 | 0 |
| 1993 | 43 | 0 |
| 1994 | 48 | 0 |
| 1995 | 41 | 0 |
| 1996 | 49 | 0 |
| 1997 | 58 | 0 |
| 1998 | 107 | 0 |
| 1999 | 104 | 0 |
| 2000 | 153 | 0 |
| 2001 | 159 | 62 |
| 2002 | 160 | 244 |
| 2003 | 170 | 188 |
| 2004 | 173 | 255 |
| 2005 | 199 | 351 |
| 2006 | 206 | 350 |
| 2007 | 204 | 413 |
| 2008 | 199 | 420 |
| 2009 | 223 | 436 |
| 2010 | 343 | 415 |
| 2011 | 338 | 457 |
| 2012 | 373 | 477 |
| 2013 | 400 | 442 |
| 2014 | 435 | 503 |
| 2015 | 484 | 613 |
| 2016 | 494 | 578 |
| 2017 | 512 | 526 |
| 2018 | 438 | 484 |
| 2019 | 481 | 550 |
| 2020 | 539 | 690 |
| 2021 | 491 | 752 |
| 2022 | 533 | 729 |
| 2023 | 535 | 459 |
| 2024 | 474 | 495 |
| 2025 | 406 | 386 |
| 2026 | 246 | 275 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Die bonding structure and method of manufacturing the same29 Sep 2026US 12,751,124 B2Materials Technology Corporation
- IC chip mounting device and IC chip mounting method29 Sep 2026US 12,751,255 B2Sato Holdings Kabushiki Kaisha/ Sato Corporation
- Submounts with stud protrusions for semiconductor packages29 Sep 2026US 12,751,305 B2
- Semiconductor packages and methods of manufacturing thereof8 Oct 2026US 2026/0314284 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Pick-and-place tool and method of manufacturing semiconductor structure8 Oct 2026US 2026/0314303 A1Taiwan Semiconductor Manufacturing Company.Ltd
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Fan-out PoP structure with inconsecutive polymer layer720US 9,461,018 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices620US 8,877,554 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014