H10W 72/07335
Applying em radiation
Official title: {Applying EM radiation, e.g. induction heating or using a laser}
H10W72/07335 (Applying em radiation) appears on 213 US grants and 263 published applications in this corpus.
Search patents in H10W- Granted patents
- 213
- Published applications
- 263
- Assignees
- 151
- Inventors
- 590
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 5 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 3 |
| 2005 | 1 | 5 |
| 2006 | 2 | 1 |
| 2007 | 1 | 4 |
| 2008 | 1 | 4 |
| 2009 | 0 | 4 |
| 2010 | 3 | 3 |
| 2011 | 6 | 7 |
| 2012 | 5 | 13 |
| 2013 | 3 | 5 |
| 2014 | 5 | 2 |
| 2015 | 6 | 12 |
| 2016 | 7 | 16 |
| 2017 | 13 | 22 |
| 2018 | 12 | 26 |
| 2019 | 22 | 18 |
| 2020 | 25 | 33 |
| 2021 | 13 | 19 |
| 2022 | 25 | 23 |
| 2023 | 16 | 11 |
| 2024 | 14 | 11 |
| 2025 | 10 | 12 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laser transfer of microelectronic device and associated conductive pad15 Sep 2026US 12,740,464 B2Coherent LaserSystems GmbH & Co. KG
- Low temperature substrate bonding method4 Aug 2026US 12,702,040 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of making a semiconductor package with graphene for die attach21 Jul 2026US 12,690,316 B2STATS ChipPAC Pte. Ltd.
- Method for welding an attachment piece to a semiconductor metallisation by laser welding14 Jul 2026US 12,678,894 B2Siemens Aktiengesellschaft
- IC chip mounting device, and IC chip mounting method24 Mar 2026US 12,588,532 B2Kabushiki Kaisha Sato
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Heat-dissipating semiconductor package with embedded heat-conducting member, method for manufacturing the same, and induction-heating soldering device used in manufacturing the same24 Sep 2026US 2026/0293670 A1Bs Technics Co., Ltd.
- Semiconductor Device and Method of Making Using Ultraviolet Light for Photonics Protection17 Sep 2026US 2026/0283012 A1STATS ChipPAC Pte. Ltd.
- Microwave-reactive micro-heater, method for device transfer and bonding using the same, and apparatus therefor13 Aug 2026US 2026/0239499 A1Electronics and Telecommunications Research Institute
- Laser compression bonding device and method4 Jun 2026US 2026/0157214 A1STATS ChipPAC Management Pte. Ltd.
Most cited
By later US patents
- Laser assisted transfer welding process144US 9,161,448 B2Semprius, Inc. · 2015
- Semiconductor device having improved test electrodes101US 5,734,199 AMatsushita Electric Industrial Co., Ltd. · 1998
- Bonding a non-metal body to a metal surface using inductive heating70US 7,452,800 B2The Regents of the University of California · 2008
- Method of manufacturing circuit module58US 5,829,125 ATaiyo Yuden Co., Ltd. · 1998
- Flip-chip light emitting diode device without sub-mount58US 7,179,670 B2GELcore, LLC · 2007