Laser transfer of microelectronic device and associated conductive pad

Abstract

A laser transfer method includes transferring a pad of conductive paste from a conductive-paste layer on a first donor substrate to a receiver substrate by laser-induced forward transfer, and transferring a microelectronic device from a second donor substrate to the pad of conductive paste on the receiver substrate by laser-induced forward transfer. The two steps of laser-induced forward transfer may be performed in the same laser-based machine. The presently disclosed method is applicable to the manufacture of microLED displays. In this context, the disclosed method may yield significant cost reductions, at least by virtue of requiring fewer processing steps and tools than conventional schemes.

Dependencies are inferred from the claim text.