Method for welding an attachment piece to a semiconductor metallisation by laser welding
AssigneeSiemens Aktiengesellschaft
InventorsMarkus Lasch, Friedrich Lupp, Stefan Stegmeier
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Abstract
Various teachings of the present disclosure include a method for welding an attachment piece to a semiconductor metallization using laser welding. The method may include: arranging an attachment piece having a flat side with a thin point so the flat side faces the semiconductor metallization; and welding the flat side to the semiconductor metallization. The flat side rests against a flat side of the semiconductor metallization over an entire surface area of the flat side. The thin point is formed with a cup shape of the attachment piece. The cup shape is open in the direction away from the semiconductor metallization.
Claims11
A method for welding an attachment piece to a semiconductor metallization using laser welding, the method comprising:
- arranging the attachment piece having a cup shape having a flat base with a thin point so the flat base faces the semiconductor metallization and an opening of the cup is closed by a cover in a direction away from the semiconductor metallization;
- and
- welding the flat base to the semiconductor metallization by melting the cover with a laser so a resulting molten material from the cover wets the thin point;
- wherein the flat base rests against a flat side of the semiconductor metallization over an entire surface area of the flat base.
An electronics module comprising:
- a semiconductor metallization;
- and
- an attachment piece welded to the semiconductor metallization;
- wherein the attachment piece has a cup shape with a flat base having a thin point facing the semiconductor metallization and an opening of the cup in a direction away from the semiconductor metallization;
- and
- the flat base is welded to the semiconductor metallization;
- the flat base rests against a flat side of the semiconductor metallization over an entire surface area of the flat base.
Dependencies are inferred from the claim text.