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AssigneeTaiyo Yuden Co., Ltd.
InventorsMasayuki Fujimoto, Matsuo Nakazawa, Hiroshi Takahashi, Kazutaka Suzuki, Koichiro Isuzuku
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The present invention relates to a method of manufacturing a circuit module through the use of a wireless bonding technique. In this invention, in order to achieve component assembly without experiencing thermal and mechanical stresses, in the circuit module manufacturing method in which an external electrode of a component and a conductor of a substrate are connected with each other according to the wireless bonding technique, the substrate has a laser beam transmissible property, and after the component is placed on an assembly surface of the substrate, a laser beam is applied from a surface of the substrate opposite to the assembly surface thereof to a connecting spot. The laser beam passing through the substrate heats the connecting spot so that the connection between the external electrode of the component and the conductor of the substrate is made by phase transition or diffusion.
A wireless bonding method of connecting an external electrode of a component to a conductor on an assemble surface of a laser beam transmissible substrate, the electrode and conductor being in contact at a connection spot, the method comprising:
Dependencies are inferred from the claim text.