Heat-dissipating semiconductor package with embedded heat-conducting member, method for manufacturing the same, and induction-heating soldering device used in manufacturing the same

A heat-dissipating semiconductor package with an embedded heat-conducting member comprising:

• a board;
• a semiconductor chip mounted on the board;
• a molding part surrounding a side surface of the semiconductor chip on the board;
• and
• a heat-conducting member embedded in the molding part and dissipating heat generated from the semiconductor chip to the outside of the molding part.

A method for manufacturing a heat-dissipating semiconductor package with an embedded heat-conducting member, comprising:

• providing a semiconductor package in which a packaging process of a semiconductor chip is completed;
• forming an engraved portion with an uneven surface formed on at least one surface of a molding part configuring an outer shape of the semiconductor package by laser processing;
• vapor-depositing a metal layer on the concave surface by plating;
• dispensing solder paste on the metal layer;
• mounting a heat-conducting sheet on the solder paste;
• and
• melting the solder paste by heating the solder paste.