Semiconductor device having improved test electrodes
AssigneesMatsushita Electric Industrial Co., Ltd., Matsushita Electronics Corporation
InventorsTetsuo Kawakita, Kazuhiko Matsumura, Ichiro Yamane
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AssigneesMatsushita Electric Industrial Co., Ltd., Matsushita Electronics Corporation
InventorsTetsuo Kawakita, Kazuhiko Matsumura, Ichiro Yamane
Estimating the term…
The main surface of a first semiconductor chip having a first functional element is formed with first testing electrodes for testing the electrical characteristics of the first functional element and first connecting electrodes electrically connected to the first functional element. The main surface of a second semiconductor chip having a second functional element is formed with second testing electrodes for testing the electrical characteristics of the second functional element and second connecting electrodes electrically connected to the second functional element. The first semiconductor chip and the second semiconductor chip are integrated by using an insulating resin, with first bumps formed on the first connecting electrodes being bonded to third bumps formed on the second connecting electrodes.
A semiconductor device comprising:
Dependencies are inferred from the claim text.