US 2026/0283012 A1 · Semiconductor Device and Method of Making Using Ultraviolet Light for Photonics Protection

Abstract

A semiconductor device is manufactured using a transparent carrier. A build-up interconnect structure is formed on the transparent carrier. An opening is formed through the build-up interconnect structure. A semiconductor die is disposed over the build-up interconnect structure with a photonic circuit of the semiconductor die aligned to the opening. An ultraviolet (UV) lamp is disposed over the carrier opposite the semiconductor die. The UV lamp emits a UV light that impinges on the photonic circuit through the carrier and opening. An underfill is deposited between the build-up interconnect structure and semiconductor die while the UV lamp emits the UV light. The underfill is a photobond acrylate. The UV light cures the underfill before the underfill flows into the opening.

Claims25

Dependent claims

A method of making a semiconductor device, comprising:

providing a transparent carrier;
forming a build-up interconnect structure on the transparent carrier;
forming an opening through the build-up interconnect structure;
disposing semiconductor die over the build-up interconnect structure with a photonic circuit of the semiconductor die aligned to the opening;
disposing an ultraviolet (UV) lamp over the carrier opposite the semiconductor die, wherein the UV lamp emits a UV light that impinges on the photonic circuit through the carrier and opening;
and
depositing an underfill between the build-up interconnect structure and semiconductor die while the UV lamp emits the UV light.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor Device and Method of Making Using Ultraviolet Light for Photonics Protection

Life of this patent

Semiconductor Device and Method of Making Using Ultraviolet Light for Photonics Protection

Life of this patent

Abstract

Claims25