US 9,161,448 B2Granted

Laser assisted transfer welding process

AssigneeSemprius, Inc.

InventorsEtienne Menard, Matthew Meitl, John A. Rogers

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Abstract

A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.

Claims27

Dependent claims

A method of printing transferable components, the method comprising:

providing a eutectic layer comprising a conductive material on a surface of a target substrate;
pressing a stamp including at least one transferable semiconductor component thereon on the target substrate such that the at least one transferable component and the surface of the target substrate contact opposite surfaces of the eutectic layer, wherein the at least one transferable semiconductor component comprises a plurality of semiconductor dies, wherein respective ones thereof are on respective protruding post features of the stamp;
during pressing of the stamp on the target substrate, exposing the at least one transferable component to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer;
and then
separating the stamp from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate.

2 more elements

A process for printing transferable components, comprising the steps of:

(a) providing a eutectic layer comprising a conductive material on a surface of a target substrate;
(b) pressing a stamp including at least one transferable semiconductor component thereon on the target substrate such that the at least one transferable component and the surface of the target substrate contact opposite surfaces of a the eutectic layer, wherein the at least one transferable semiconductor component comprises a plurality of semiconductor dies, wherein respective ones thereof are on respective protruding post features of the stamp;
(c) during pressing of the stamp on the target substrate, exposing the at least one transferable component to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer;
and
(d) separating the stamp from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 13/352,876Filed 18 Jan 2012 · continuation in part
Priority: 29 Mar 2010
Published: US 2012/0115262 A110 May 2012
Granted: 13 Oct 2015
Term ends: Not estimatedThe source records don’t support an estimate.

Classification77 codes

H10D 86/0214
Of multiple TFTs: using temporary substrates
H01S 5/02315
Mount members, e.g. sub-mount members: support members, e.g. bases or carriers
H05K 1/18
Printed circuits: structurally associated with non-printed electric components
H05K 13/04
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components: mounting of components , e.g. of…