H10W 72/07332
Compression bonding
Official title: {Compression bonding, e.g. thermocompression bonding}
H10W72/07332 (Compression bonding) appears on 1,344 US grants and 1,761 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,344
- Published applications
- 1,761
- Assignees
- 499
- Inventors
- 3,093
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 3 |
| 2003 | 2 | 2 |
| 2004 | 2 | 3 |
| 2005 | 1 | 4 |
| 2006 | 2 | 13 |
| 2007 | 5 | 8 |
| 2008 | 4 | 15 |
| 2009 | 12 | 24 |
| 2010 | 13 | 20 |
| 2011 | 13 | 27 |
| 2012 | 18 | 63 |
| 2013 | 39 | 51 |
| 2014 | 41 | 96 |
| 2015 | 68 | 136 |
| 2016 | 102 | 118 |
| 2017 | 96 | 134 |
| 2018 | 102 | 109 |
| 2019 | 116 | 131 |
| 2020 | 134 | 172 |
| 2021 | 123 | 147 |
| 2022 | 108 | 144 |
| 2023 | 104 | 93 |
| 2024 | 97 | 94 |
| 2025 | 75 | 87 |
| 2026 | 53 | 67 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Cu—Cu direct welding for packaging application in semiconductor industry29 Sep 2026US 12,751,311 B2The University of Hong Kong
- Semiconductor package manufactured through a thermocompression process using a non-conductive film (NCF)29 Sep 2026US 12,751,324 B2Samsung Electronics Co., Ltd.
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Film-like adhesive agent, adhesive film, dicing/die-bonding integrated film, and method for producing semiconductor device1 Oct 2026US 2026/0305252 A1Resonac Corporation
- Memory-only cubes and methods of forming the same1 Oct 2026US 2026/0305497 A1Micron Technology, Inc.
- Sintering film frames and related methods24 Sep 2026US 2026/0293736 A1Semiconductor Components Industries, LLC
- Semiconductor package manufactured through a thermocompression process using a non-conductive film (ncf)24 Sep 2026US 2026/0293767 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Three-dimensional device fabrication method248US 7,354,798 B2International Business Machines Corporation · 2008
- Method for wafer-wafer bonding238US 9,941,241 B2International Business Machines Corporation · 2018
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials229US 6,335,263 B12002
- Heterogeneous annealing method and device223US 9,184,125 B2Ziptronix, Inc. · 2015