H10W 72/07333
Ultrasonic bonding
Official title: {Ultrasonic bonding, e.g. thermosonic bonding}
H10W72/07333 (Ultrasonic bonding) appears on 110 US grants and 129 published applications in this corpus.
Search patents in H10W- Granted patents
- 110
- Published applications
- 129
- Assignees
- 94
- Inventors
- 318
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 2 |
| 2006 | 1 | 7 |
| 2007 | 3 | 3 |
| 2008 | 0 | 5 |
| 2009 | 6 | 7 |
| 2010 | 3 | 7 |
| 2011 | 0 | 5 |
| 2012 | 6 | 16 |
| 2013 | 10 | 8 |
| 2014 | 7 | 8 |
| 2015 | 7 | 12 |
| 2016 | 9 | 7 |
| 2017 | 7 | 4 |
| 2018 | 6 | 7 |
| 2019 | 5 | 7 |
| 2020 | 9 | 5 |
| 2021 | 7 | 5 |
| 2022 | 1 | 3 |
| 2023 | 3 | 4 |
| 2024 | 2 | 2 |
| 2025 | 1 | 2 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing semiconductor package, semiconductor package, and imaging apparatus25 Aug 2026US 12,720,899 B2Samsung Electronics Co., Ltd.
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Bonding apparatus and bonding method using the same26 May 2026US 12,642,134 B2Samsung Display Co., Ltd.
- Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor17 Mar 2026US 12,581,983 B2Danfoss Silicon Power GmbH
- Sintering materials and attachment methods using same7 Oct 2025US 12,438,121 B2Alpha Assembly Solutions Inc.
- Sintering materials and attachment methods using same15 Jan 2026US 2026/0018559 A1Alpha Assembly Solutions Inc.
- Semiconductor device and manufacturing method thereof25 Sep 2025US 2025/0300107 A1Fuji Electric Co., Ltd.
- Semiconductor device and method for manufacturing semiconductor device11 Sep 2025US 2025/0285944 A1Rohm Co., Ltd.
- Circuit board and manufacturing method11 Jul 2024US 2024/0234366 A9NHK Spring Co., Ltd.
- Circuit board and manufacturing method25 Apr 2024US 2024/0136325 A1NHK Spring Co., Ltd.
Most cited
By later US patents
- Technique for mounting a semiconductor die155US 5,888,847 ALSI Logic Corporation · 1999
- Semiconductor chip and method for manufacturing the same72US 7,067,926 B2Semiconductor Energy Laboratory Co.Ltd. · 2006
- Flip-chip light emitting diode device without sub-mount58US 7,179,670 B2GELcore, LLC · 2007
- Method of bonding an electronic device to a ceramic substrate51US 4,459,166 AJohnson Matthey PLC · 1984
- Electronic component assembly for maintaining component alignment during soldering35US 5,895,973 ADelco Electronics Corporation · 1999