Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor

A method for establishing electrical contacting between an electrical conductor and a semiconductor, said method comprising the steps of:

• first, fastening a bent or folded shaped metal body to the semiconductor by a first fastening method, and
• second, fastening the electrical conductor to the shaped metal body by a second fastening method,
• wherein the bend or fold of the shaped metal body is located between a first surface of the semiconductor and an opposing surface of the electrical conductor, and
• wherein the second fastening method includes ultrasonic welding, laser welding or thermosonic bonding.

A semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor for forming an electrically conducting contact surface for an electrical conductor,

• wherein the electrical conductor is stacked on top of the semiconductor,
• wherein the shaped metal body is bent or folded,
• wherein the bend or fold of the shaped metal body is located between a first surface of the semiconductor and an opposing surface of the electrical conductor,
• wherein the shaped metal body is connected to the semiconductor by nanowires, and
• wherein the shaped metal body is connected to the electrical conductor by nanowires.